A List of Responders
Virtual Manufacturing Background Project
E-mail: graver@rpi.edu
RENSSELAER'S ELECTRONICS
AGILE MANUFACTURING RESEARCH INSTITUTE
Electronics is a major element of nearly every product sector
including automotive, communications, computers, consumer
products and defense. The competitive pressures for greater
functionality and higher performance has forced electronics
designers to utilize novel, high density packaging technologies to
provide their products with a competitive edge. At the same time,
this rapid evolution of device packaging technology poses new and
difficult challenges to the design and manufacturing operations in
these industries. There are several considerations which
predominantly affect the decisions of today's electronics designers.
First, high density packaging technologies offer a competitive edge
in speed and performance, but involve higher manufacturing risk.
Second, high density packaging processes such as surface mount
technologies and multichip module interconnection require the use
of automation for their development and implementation. Third,
systematic test and inspection approaches must be designed and
integrated into the manufacturing operations. Fourth, electronics
enterprises are increasingly distributed, organizationally and
geographically, as design, manufacturing, and market efforts are
focused on local centers of expertise with sophisticated
communications links. These considerations challenge us to help
bridge the gap between design and manufacture of electronics, and
Rensselaer's Electronics Agile Manufacturing Research Institute
(Rensselaer-EAMRI) is a direct response to this challenge.
The demands of global competition will require electronics
manufacturing enterprises that focus on shorter cycle times, lower
volume production runs, greater product variety and
customization, higher quality, and closer coupling among
suppliers, manufacturers, and customers. Agile manufacturing
provides a conceptual framework to approach these problems
through flexibility in technologies and organizations and improved
information infrastructure. The Rensselaer-EAMRI provides a
national focus for the development and interchange of methods to
enable adoption of agile manufacturing in the U.S. electronics
industry. The Rensselaer-EAMRI highlights two major themes:
Distributed Electronics Manufacturing
Information Infrastructure and Networks
PUBLICATION SERIES
TR: Technical Report Series (access may be restricted)
R: Report (access may be restricted)
P: Paper Series
TR94-1 "Integrating CORBA and STEP Technologies for
Electronics Agile Manufacturing", Ray Ruixiang Liu,
January 1995.
R94-1 R. J. Graves, D. L. Millard, and A.C. Sanderson, "EAMRI
Operational Plan", December 15, 1994.
R95-1 R. J. Graves, D. L. Millard, and A. C. Sanderson, "EAMRI
Progress Report", February 15, 1995.
P94-1 " Multipath Agility in Electronics Manufacturing", Arthur C.
Sanderson, Robert J. Graves, and Don L. Millard, 1994 IEEE
International Conference on Systems, Man, and Cybernetics.
P95-1 "Rensselaer's Electronics Agile Manufacturing Research
Institute", Robert J. Graves, and Arthur C. Sanderson,
Proceedings of the 1995 NSF Design and Manufacturing
Grantee's Conference LaJolla, CA, January 4-6, 1995, pg 103-104.
P95-2 "Evolutionary Speciation Using Minimal Reprsentation
Size Clustering", Proceedings of the Fourth Annual Conference
on Evolutionary Programming, Cem Hocaoglu and Arthur C.
Sanderson, December 23, 1994.
P95-3 "Assessment of Agile Manufacturing for the Electronics
Sector", Ronald J. Gutmann, and Robert J. Graves, Proceedings
of the Agility Forum, Atlanta, GA, March 7-9, 1995.
P95-4 "Future Packaging of Integrated Circuit Chips-An
Opportunity for Agility in the Electronics Sector", Ronald J.
Gutmann, and Don L. Millard, Proceedings of the Agility Forum,
Atlanta, GA, March 7-9, 1995.
EAMRI Home Page
http://www.dmi.rpi.edu/research/EAMRI/EAMRI.html
A List of Responders
Virtual Manufacturing Background Project
Virtual Manufacturing Home Page