Uniformity Prediction

Chamber Pressure 20 Torr

Wafer Temperature 750 C

Silane Flow Rate 70 sccm

Total Flow Rate 23.5 slm

Uniform wafer temperature profile (750 C)

Non-uniform deposition rate profile (7.5% variation)

Even in thermally activated temperature regime!

Deposition Rate (Angstroms/min)

Downstream Side

Upstream Side

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